FDA Requirements for Device Labeling: Development, Contents, Distribution, and Changes – Webinar By GlobalCompliancePanel

Conference: 6 Dec 2011, Online Training, online training, United States. Organized by GlobalCompliancePanel.
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Nanotechnology and the Challenges of Equity, Equality and Development (Yearbook of Nanotechnology in Society)

Nanotechnology and the Challenges of Equity, Equality and Development (Yearbook of Nanotechnology in Society)

Nanotechnology is enabling applications in materials, microelectronics, health, and agriculture, which are projected to create the next big shift in production, comparable to the industrial revolution. Such major shifts always co-evolve with social relationships. This book focuses on how nanotechnologies might affect equity/equality in global society. Nanotechnologies is likely to open gaps by gender, ethnicity, race, and ability status, as well as between developed and developing countries, unless steps are taken now to create a different outcome. Organizations need to change their practices, and cultural ideas must be broadened if currently disadvantaged groups are to have a more equal position in the nano-society rather than a more disadvantaged one. Economic structures are likely to shift in the nano-revolution, but policymakers and participatory processes can invent newly invented institutions for social welfare, better suited to the new economic order than those of the past.

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Russia solar and photovoltaic industry development trend 07

In the strong economic growth, stable political situation, rich university / state-funded projects and increasing foreign investment, driven by Russia’s semiconductor industry is becoming more and more powerful. Marks a move into this new era is the recent commissioning of a series of semiconductor manufacturing process: from 130nm, 90nm until 65nm, and 45nm technology also announced the launch of the project, in addition to the Russian nanotechnology industry irksome to upgrade, and polysilicon materials, including 10 manufacturing projects, including significant progress in the field of PV.
Russia’s high level of education, academic research in semiconductor physics history, precision applications (aviation, communications, etc.) in electronic systems manufacturing and the rapid growth of industrial equipment and materials manufacturers to create a large number of new opportunities, coupled with a stable political environment and good business climate, Russia’s economy is prosperous development. In 2006 the GDP increased by 6.8% growth in 2007 will be even greater. With the rapid expansion of IT-related markets, governments and enterprises in the ICT infrastructure investment continue to grow. With the region’s growth in consumer spending, local semiconductor manufacturing has become the country’s priority development objectives, and Russia’s semiconductor manufacturing is also rising among the number of items.
Russian semiconductor manufacturing projects
1. Russia’s largest semiconductor manufacturer and its parent company, Mikron has been an Sitronics reached an agreement with STMicroelectronics. Under the agreement, Mikron will receive from their technology road map from the 0.18-micron CMOS EEPROM process until the 65nm manufacturing technology. Although the implementation of the project subject to export control issues affect the delay of three months, but the project is still scheduled to start in the first quarter of 2008 (the first block of silicon production).
2. “Angstrem T” has been partnering with AMD began production at its wafer fab 130nm CMOS process. This fab is set up purely for the global foundry market. Angstrem the production line program launched in late 2009, and intends to further expand production capacity by 2010, and the upgrade to 90nm ~ 65nm skills. After the completion of the technology upgrade, Angstrem deep plowing will start the local market?? Continuously improve local market share.
3.2007 8 at the end, Advanced Electronic Systems (AES) announced that the company plans to acquire Altis, intended to produce customized products in the 200mm wafer supply the European and Russian market. Headquartered in Moscow, a holding company Global Information Services (GIS) is the parent company of AES. GIS by the Russian Ministry of Commerce and Industry jointly set up with the Russian Academy of Sciences and the Russian Development Bank Vnesheconombank and the Russian Government. Altis acquisition shows the GIS industry companies through further acquisitions and production base, and constantly promote the transfer of technology on the market heating up.
4. In October 2007, Russian Economic Development under the Ministry of Investment Commission approved the construction of a technology Mikron Sitronics to hit the 65 ~ 45nm fab production plan to flash memory chips. Therefore, from now until 2009, Sitronics will invest 2.3 billion U.S. dollars building the fab, plant construction will begin in 2008 and plans to put into operation in 2009. This new fab will serve as an independent business, estimated to hold 51% stake in Sitronics, the remaining 49% of the shares held by the state. It is reported that capital investment will come from control of the Russian Ministry of Economic Development Investment Fund.
Investment bank Credit Suisse (Credit Suisse) was evaluated for the project. According to the investment bank’s report said the discounted return on investment period of 10 years, the weighted average cost of capital of 8.64%. Wafer fab will reach 30,000 square meters of production area, of which 10,000 square meters of clean room area. Initial production capacity of 3,000 pieces per month, and further expand to 10,000 pieces per month. The new fab will have 1,700 employees.
This new wafer manufacturing semiconductor chips for the local market, products include digital TV, GLONAS system receiver, 3G mobile communications with the SIM card and other consumer electronic products.
5. In Russia, Belarus’s Integral region, a 100% funded by the state of semiconductor manufacturing projects being prepared. The project uses the 0.35 micron CMOS technology, wafer size is 200mm, the initial capacity of 1,000 wafers per month, and plans to further expand to 2,000 pieces per month. Products, including processors, memory, advanced logic chips and so on. The project is the general contractor M + W Zander, also Intecs and Fraunhofer Institute also took part. Production line planned to put into operation in April 2008.

Advanced Techniques for Assessment Surface Topography: Development of a Basis for 3D Surface Texture Standards “Surfstand”

Product Description
This publication deals with the latest developments in the field of 3D surface metrology and will become a seminal text in this important area.

It has been prepared with the support of the European Community’s Directorate General XII and represents the culmination of research conducted by 11 international partners as part of an EU-funded project. The aim of the project is to inform standards bodies of the possibilities that exist for a new international standard covering the field of 3D surface characterisation.

The book covers a description of the proposed 3D surface parameters and advanced filtering techniques using wavelet and robust Gaussian methodologies. The next generation areal surface characterisation theories are discussed and their practical implementation is illustrated. It describes techniques for calibration of 3D instrumentation, including stylus instruments as well as scanning probe instrumentation. Practical verification of the 3D parameters and the filtering is illustrated through a series of case studies which cover bio-implant surfaces, automotive cylinder liner and steel sheet. Finally, future developments of the subject are alluded to and implications for future standardisation and development are discussed.

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Advanced Manufacturing Technologies and Workforce Development

Product Description
This study examines the relationship between organizational performance, advanced manufacturing technologies and workforce development activities. In response to domestic and international competitive pressures, manufacturers are making increasing expenditures in both labor and technology. Both corporate and government surveys report that billions of dollars a year are spent for worker training and new technology by U.S. manufacturers. Despite these expenditures, little empirical evidence exists about the relationship between worker development activities and advanced technologies or the organizational outcomes from their combined use.

In this study, multiple workforce development activities and advanced technology were defined and compared to several types of organizational performance at a variety of manufacturing plants in the Midwest. Human resource managers completed surveys that assessed areas of worker development, technology, environment and technology-driven workplace needs. Results indicate modest support for the relationship between technology, workforce development and organizational performance. Strong support, however, was found for the relationship between relational and skill needs due to changes in technology and the plant emphasis on process and individual worker development. This suggest that managerial perceptions regarding workplace changes from technology may be amore important factor than the technology itself in determining the type of workforce development activities provided. In addition, findings supported the use of multiple workforce development activities.

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