MM, MEMS & NANO Live UK 2012

Exhibition: 25 Sep 2012 – 26 Sep 2012, Birmingham, United Kingdom. Organized by Rapid News Communicationas.
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Microengineering, MEMS, and Interfacing: A Practical Guide

Microengineering, MEMS, and Interfacing: A Practical Guide

MEMS devices are finding increasingly widespread use in a variety of settings, from chemical and biological analysis to sensors and actuators in automotive applications. Along with this massive growth, the field is still experiencing growing pains as fabrication processes are refined and new applications are attempted. Anyone serious about entering the field must have a realistic knowledge of just what is possible with MEMS technologies as well as the myriad issues involved in fabrication and device integration.

Microengineering, MEMS, and Interfacing: A Practical Guide provides a straightforward, down-to-earth overview of the current state of MEMS technology. The first section systematically reviews the various bulk and surface micromachining methods, photolithography masks, and nonsilicon processes, examining their capabilities, limitations, and suggested uses. Next, the author details the characteristics of individual devices and systems, their advantages and shortcomings, and how they can be combined to achieve desired functionality. He includes condensed introductions to relevant chemistry and biochemistry and then demonstrates applications of MEMS in these areas. Beginning with a short introduction to electronics, the final section explores the issues involved in interfacing MEMS components with other systems.

With judicious use of illustrations to clarify the discussion, Microengineering, MEMS, and Interfacing: A Practical Guide offers hands-on tools for solving specific problems along with the insight necessary to use them most effectively.

List Price: $ 139.95

Price: $ 139.95

MEMS and Microstructures in Aerospace Applications

MEMS and Microstructures in Aerospace Applications

The promise of MEMS for aerospace applications has been germinating for years, and current advances bring the field to the very cusp of fruition. Reliability is chief among the challenges limiting the deployment of MEMS technologies in space, as the requirement of zero failure during the mission is quite stringent for this burgeoning field. MEMS and Microstructures in Aerospace Applications provides all the necessary tools to overcome these obstacles and take MEMS from the lab bench to beyond the exosphere.

The book begins with an overview of MEMS development and provides several demonstrations of past and current examples of MEMS in space. From this platform, the discussion builds to fabrication technologies; the effect of space environmental factors on MEMS devices; and micro technologies for space systems, instrumentation, communications, thermal control, guidance navigation and control, and propulsion. Subsequent chapters explore factors common to all of the described systems, such as MEMS packaging, handling and contamination control, material selection for specific applications, reliability practices for design and application, and assurance practices.

Edited and contributed by an outstanding team of leading experts from industry, academia, and national laboratories, MEMS and Microstructures in Aerospace Applications illuminates the path toward qualifying and integrating MEMS devices and instruments into future space missions and developing innovative satellite systems.

List Price: $ 149.95

Price: $ 149.95

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MEMS: Applications

MEMS: Applications

As our knowledge of MEMS continues to grow, so does The MEMS Handbook. The field has changed so much that this Second Edition is now available in three volumes. Individually, each volume provides focused, authoritative treatment of specific areas of interest. Together, they comprise the most comprehensive collection of MEMS knowledge available, packaged in an attractive slipcase and offered at a substantial savings. This best-selling handbook is now more convenient than ever, and its coverage is unparalleled.

The first of three volumes, MEMS: Introduction and Fundamentals covers the theoretical and conceptual underpinnings of the field, emphasizing the physical phenomena that dominate at the micro-scale. It also explores the mechanical properties of MEMS materials, modeling and simulation of MEMS, control theory, and bubble/drop transport in microchannels. Chapters were updated where necessary, and the book also includes two new chapters on microscale hydrodynamics and lattice Boltzmann simulations. This volume builds a strong foundation for further study and work in the MEMS field.

MEMS: Introduction and Fundamentals comprises contributions from the foremost experts in their respective specialties from around the world. Acclaimed author and expert Mohamed Gad-el-Hak has again raised the bar to set a new standard for excellence and authority in the fledgling fields of MEMS and nanotechnology.

List Price: $ 94.95

Price: $ 94.95

Handbook of Silicon Based MEMS Materials and Technologies Reviews

Handbook of Silicon Based MEMS Materials and Technologies

A comprehensive guide to MEMS materials, technologies and manufacturing, examining the state of the art with a particular emphasis on current and future applications.

Key topics covered include:

• Silicon as MEMS material
• Material properties and measurement techniques
• Analytical methods used in materials characterization
• Modeling in MEMS
• Measuring MEMS
• Micromachining technologies in MEMS
• Encapsulation of MEMS components
• Emerging process technologies, including ALD and porous silicon

Written by 73 world class MEMS contributors from around the globe, this volume covers materials selection as well as the most important process steps in bulk micromachining, fulfilling the needs of device design engineers and process or development engineers working in manufacturing processes. It also provides a comprehensive reference for the industrial R&D and academic communities.

• Veikko Lindroos is Professor of Physical Metallurgy and Materials Science at Helsinki University of Technology, Finland.
• Markku Tilli is Senior Vice President of Research at Okmetic, Vantaa, Finland.
• Ari Lehto is Professor of Silicon Technology at Helsinki University of Technology, Finland.
• Teruaki Motooka is Professor at the Department of Materials Science and Engineering, Kyushu University, Japan.

. Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques
. Shows how to protect devices from the environment and decrease package size for dramatic reduction of packaging costs
. Discusses properties, preparation, and growth of silicon crystals and wafers
. Explains the many properties (mechanical, electrostatic, optical, etc), manufacturing, processing, measuring (incl. focused beam techniques), and multiscale modeling methods of MEMS structures

List Price: $ 245.00

Price: $ 245.00

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