MICROMACHINING ELECTREOCHEM DISCH

MICROMACHINING ELECTREOCHEM DISCH

Micromixers is the first comprehensive study of the fundamentals, practical designs, fabrication technologies, characterization techniques, and applications of micromixers. Readers can turn into users – and potentially inventors – of novel micromixer designs. Modelling, fabrication and testing discussions are detailed and the content is thoroughly illustrated with over 200 figures, tables and examples. Carefully prepared illustrations make the book not only a must-read but a must-own for those involved in the field. From the back cover This highly readable book offers a broad look at the fundamentals, design, and fabrication of micromixers, as well as specific applications in chemistry and life sciences. Micromixing is the predominant process taking place in most microfluidic devices for medical diagnostics, drug discovery, genetic sequencing, proteomics, and chemical production. It also has implications for national security via portable detection systems for chemical weapons and explosives. Written by a best-selling author on this subject, Micromixers: Fundamentals, Design, and Fabrication is for practicing engineers who need current, applicable knowledge. It will also interest chemistry and biochemistry students considering working in this fast growing field, for whom it will provide a strong foundation.

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Bonding in Microsystem Technology

Product Description

Bonding in Microsystem Technology concerns the exciting field of microsystems (known under varying names as: MEMS, µTAS (analytical or chemical Microsystems), MOEMS: the micro-miniature devices, utilizing extremely miniaturized mechanical structures made usually from silicon by wet deep anisotropic etching. Such structures cannot be used directly, they must be designed and fabricated as a part of the three – dimensional multi-layer sandwich built from silicon or silicon and glass. The procedures of formation of such a sandwich are known as bonding. The book contains the description of wet anisotropic micromachining of basic silicon micromechanical constructions and their utilization in microsystems followed by the detailed discussion of all of methods of bonding used for the formation of silicon and silicon-glass microsystems, with the special attention paid to the anodic bonding technique.

Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Following this, presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author’s personal experience.

Bonding in Microsystem Technology is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. It can serve as the encyclopaedia of wet etching and bonding for microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students. The book contains a large number of illustrations, algorithmic flow-charts and microsystems description and a rich index of literature sources.

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Micromachining Using Electrochemical Discharge Phenomenon: Fundamentals and Application of Spark Assisted Chemical Engraving

Product Description
This book presents an unconventional and largely unknown technology, which is able to micro-machine at relatively low cost glass, polymers and other materials. This process is called Spark Assisted Chemical Engraving (SACE), or Electro Chemical Discharge Machining (ECDM). First presented in 1968 in Japan by Kurafuji and Suda, this technology was studied essentially in the academic world and mainly applied for micro-fluidic devices.

This book explains the fundamentals of SACE, promotes the technology, and encourages researchers and engineers from industry to use it for their specific applications. Therefore, the book, after presenting in details the fundaments of SACE (in particular the Electrochemical Discharges), deals mainly with practical aspects of implementing the machining technology. The book is written so that researchers from fields other than micro-technology (e.g., from life science) will be able to build a simple machining set-up, together with his mechanical work-shop, for individual needs.

• Topics include: micro- and electrochemical discharge machining (including glass), microfluidics, non-conventional manufacturing, electrochemical discharges, biocompatibility, and anode effects
• Provides applicable information for engineers in industry dealing with micromachining of glass, polymers, and ceramics
• Covers a range of microfluidic devices (including micro-TAS) with applications in various fields like chemistry and life sciences

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Micromachined Microwave Devices & Circuits

Product Description
In this book, new results on the development of micromachined circuits in the millimeter wave range, based on micromachining of Silicon as well as of III-V compounds, are presented. Original approach in design using high performance electromagnetic simulation software is also well illustrated. Electrical and microphysical characterization methods are included. The authors are representative for the European activities in the so-called “RF MEMS” (Radio-Frequency Micro-Electro-Mechanical Systems) field, a very hot topic in research and development.

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