Bonding in Microsystem Technology

Product Description

Bonding in Microsystem Technology concerns the exciting field of microsystems (known under varying names as: MEMS, µTAS (analytical or chemical Microsystems), MOEMS: the micro-miniature devices, utilizing extremely miniaturized mechanical structures made usually from silicon by wet deep anisotropic etching. Such structures cannot be used directly, they must be designed and fabricated as a part of the three – dimensional multi-layer sandwich built from silicon or silicon and glass. The procedures of formation of such a sandwich are known as bonding. The book contains the description of wet anisotropic micromachining of basic silicon micromechanical constructions and their utilization in microsystems followed by the detailed discussion of all of methods of bonding used for the formation of silicon and silicon-glass microsystems, with the special attention paid to the anodic bonding technique.

Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Following this, presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author’s personal experience.

Bonding in Microsystem Technology is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. It can serve as the encyclopaedia of wet etching and bonding for microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students. The book contains a large number of illustrations, algorithmic flow-charts and microsystems description and a rich index of literature sources.

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In Search of Business Value: Ensuring a Return on Your Technology Investment

Product Description
In today’s high-tech business world, few issues are more important than how companies can gain competitive advantage from using new technology, especially information technology (IT). In ‘In Search of Business Value’, Microsoft vice president Robert McDowell and best-selling business author William L. Simon address that problem head-on, describing the steps every organization must take to “get the best bang from each buck spent” on IT infrastructure.

Drawing on their own personal experience and that of over twenty-five corporate and IT leaders from the worlds of business and government, ‘In Search of Business Value’ covers in detail such issues as bringing organizational leaders on board in promoting the use of IT, enlisting staff support, using IT to lower costs and improve productivity, integrating the IT and business sides of an organization, and using IT to support best business practices.

IT these days is an indispensable tool in defining and achieving corporate goals. ‘In Search of Business Value’ is an indispensable tool for corporate leaders and managers looking to make IT work successfully for their organizations.

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