Optical Near-Field Recording: Science and Technology

Product Description
This textbook is written for all those wishing to understand the concepts behind modern optical recording. It also paves the way towards the future science and technology beyond the optical diffraction limit. The important keyword here is

BUY FROM AMAZON–>> Optical Near-Field Recording: Science and Technology

Bonding in Microsystem Technology

Product Description

Bonding in Microsystem Technology concerns the exciting field of microsystems (known under varying names as: MEMS, µTAS (analytical or chemical Microsystems), MOEMS: the micro-miniature devices, utilizing extremely miniaturized mechanical structures made usually from silicon by wet deep anisotropic etching. Such structures cannot be used directly, they must be designed and fabricated as a part of the three – dimensional multi-layer sandwich built from silicon or silicon and glass. The procedures of formation of such a sandwich are known as bonding. The book contains the description of wet anisotropic micromachining of basic silicon micromechanical constructions and their utilization in microsystems followed by the detailed discussion of all of methods of bonding used for the formation of silicon and silicon-glass microsystems, with the special attention paid to the anodic bonding technique.

Bonding in Microsystem Technology starts with descriptions of terminology, kinds of microsystems and market analysis. Following this, presentation of mechanisms of wet etching, set of process parameters, description of micromachining methods, examples of procedures, process flow-charts and applications of basic micromechanical structures in microsystems are shown. Next, high-temperature, low temperature and room-temperature bonding and their applications in microsystem technology are presented. The following part of the book contains the detailed description of anodic bonding, starting from analysis of properties of glasses suitable for anodic bonding, and discussion of the nature of the process. Next all types of anodic bonding and sealing procedures used in microsystem technology are presented. This part of the book finishes with examples of applications of anodic bonding in microsystem technology taken from the literature but mainly based on the author’s personal experience.

Bonding in Microsystem Technology is addressed to scientists and researchers, as well as to academic teachers and students, engineers active in the field of electric/electronics and microelectronics. It can serve as the encyclopaedia of wet etching and bonding for microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students. The book contains a large number of illustrations, algorithmic flow-charts and microsystems description and a rich index of literature sources.

BUY FROM AMAZON–>> Bonding in Microsystem Technology

Magnetic Memory: Fundamentals and Technology

Product Description
If you are a semiconductor engineer or a magnetics physicist developing magnetic memory, get the information you need with this, the first book on magnetic memory. From magnetics to the engineering design of memory, this practical book explains key magnetic properties and how they are related to memory performance, characterization methods of magnetic films, and tunneling magnetoresistance effect devices. It also covers memory cell options, array architecture, circuit models, and read-write engineering issues. You’ll understand the soft fail nature of magnetic memory, which is very different from that of semiconductor memory, as well as methods to deal with the issue. You’ll also get invaluable problem-solving insights from real-world memory case studies. This is an essential book for semiconductor engineers who need to understand magnetics, and for magnetics physicists who work with MRAM. It is also a valuable reference for graduate students working in electronic/magnetic device research.

BUY FROM AMAZON–>> Magnetic Memory: Fundamentals and Technology

Photonic Crystals: Physics and Technology

Product Description

The aim of the work is give an overview of the activity in the field of Photonic Crystal developed in the frame of COST P11 action . The main objective of the COST P11 action was to unify and coordinate national efforts aimed at studying linear and nonlinear optical interactions with Photonic Crystals (PCs), without neglecting an important aspect related to the material research as idea and methods of realizations of 3D PC, together with the development and implementation of measurement techniques for the experimental evaluation of their potential applications in different area, as for example telecommunication with novel optical fibers, lasers, nonlinear multi-functionality, display devices , opto-electronics, sensors.

The book contain contributions from authors who gave their lecture at the Cost P11 Training School.

Training School was held at the Warsaw University (2007) and National Institute of Telecommunications (May 23), Warsaw. It was attended by 23 students. The focus of the School was on the work of working groups WG1 and WG3 of the COST P11 Action, concerning the active and non-linear properties of photonic crystals and the fabrication and characterisation of photonic crystal structures. This was supported by two opening lectures providing a general introduction to the topics covered within the action and a summary of the challenges faced by and achievements of the modelling and simulation activities developed during the Action.

BUY FROM AMAZON–>> Photonic Crystals: Physics and Technology

Micromanufacturing Engineering and Technology

Product Description
This book presents applicable knowledge of technology, equipment and applications, and the core economic issues of micromanufacturing for anyone with a basic understanding of manufacturing, material, or product engineering.

It explains micro-engineering issues (design, systems, materials, market and industrial development), technologies, facilities, organization, competitiveness, and innovation with an analysis of future potential.

The machining, forming, and joining of miniature / micro-products are all covered in depth, covering: grinding/milling, laser applications, and photo chemical etching; embossing (hot & UV), injection molding and forming (bulk, sheet, hydro, laser); mechanical assembly, laser joining, soldering, and packaging.

. Presents case studies, material and design considerations, working principles, process configurations, and information on tools, equipment, parameters and control
. Explains the many facets of recently emerging additive / hybrid technologies and systems, incl: photo-electric-forming, liga, surface treatment, and thin film fabrication
. Outlines system engineering issues pertaining to handling, metrology, testing, integration & software
. Explains widely used micro parts in bio / medical industry, information technology and automotive engineering.
. Covers technologies in high demand, such as: micro-mechanical-cutting, lasermachining, micro-forming, micro-EDM, micro-joining, photo-chemical-etching, photo-electro-forming, and micro-packaging

BUY FROM AMAZON–>> Micromanufacturing Engineering and Technology

Next Page »