Sub-Half-Micron Lithography for ULSIs

Product Description
In semiconductor-device fabrication processes, lithography technology is used to print circuit patterns on semiconductor wafers. The remarkable miniaturization of semiconductor devices has been made possible only because of the continuous progress in lithography technology. However, for the trend of ever-increasing miniaturization to continue, a breakthrough in lithography technology is now needed. This book describes advanced techniques under development that represent the key to future semiconductor-device fabrication. To help the reader understand the background to developments in lithography technology, trends in ULSI technology and future prospects are reviewed, and the requirements that future lithography technology must meet are described. Several important lithography methods, such as deep UV lithography, x-ray lithography, electron-beam lithography, and focused ion-beam lithography are described in detail by experts in each area. Other relevant technologies, such as those that concern resist materials, metrology, and defect inspection and repair are also described.

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Physics at Surfaces and Interfaces: Proceedings of the International Conference Puri, India 4 – 8 March 2002

Product Description
This book contains articles in several areas involving a dominant role of surfaces and interfaces. It is divided into four sections. The first section deals with theoretical and experimental aspects of the structure and morphology of clean surfaces and adsorbed layers on surfaces. The next section concerns growth on surfaces leading to semiconductor devices with quantum well, quantum wire and quantum dot structures; also deals with spin transport in 2DEG. Section 3 is on layered synthetic microstructures (LSMs). Analysis of interface roughness and layer composition of LSMs by X-ray techniques, fabrication of hard X-ray telescopes with LSMs, and diffusion across interfaces of LSMs are discussed here. The last section contains articles dealing with semiconductor surfaces exposed to ion beams and ion-irradiated semiconductor multilayers.

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Instrumentation for a Better Tomorrow: Proceedings of a Symposium in Honor of Arnold Beckman

Product Description
On November 15, 2004, the National Academies sponsored a symposium at the Beckman Center in honor of Arnold O. Beckman. The symposium concentrated on the wide-ranging practical applications of scientific instrumentation as was the focus of much of Arnold Beckman’s career. The report begins with two presentations: a remembrance by Arnold Beckman’s daughter, Pat, and an overview of his life and accomplishments by Arnold Thackray, President of the Chemical Heritage Foundation. The next section contains presentations on the application of instrumentation in seven, diverse areas: organic chemistry, molecular and systems biology, synchrotron x-ray sources, nanoscale chemistry, forensics, and clinical medicine. Finally, there is a summary of a panel discussion on the evolving relationship between instrumentation and research.

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Thermal Conductivity 27 / Thermal Expansion 15

Product Description
Major presentation of new developments in materials science and technology

Applications in metals, composites, and polymers

Special emphasis on nanomaterials

98 participants from 16 different countries

Illustrations and tables throughout

Extensive subject index

The International Thermal Conductivity Conference-now in its 27th year- is a major international conference on materials science and technology. Seventy-five outstanding technical papers, from leading materials specialists from around the world, were presented at the conference. Published after the conference, this volume contains the complete edited texts with all tables and figures from the latest conference.

In additional to traditional topics such as thermal insulation, instrumentation and standards, the conference tried to highlight research in carbon nanotubes, nanomaterials, novel thin films, thermoelectric and composites. Thermal expansion measurements using X-ray and neutron diffraction methods were presented for the first. The conference highlighted the fact that conductivity and thermal expansion are playing important roles in advanced material research.

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Handbook of Photomask Manufacturing Technology

Product Description
As the semiconductor industry attempts to increase the number of functions that will fit into the smallest space on a chip, it becomes increasingly important for new technologies to keep apace with these demands. Photomask technology is one of the key areas to achieving this goal. Although brief overviews of photomask technology exist in the literature, the Handbook of Photomask Manufacturing Technology is the first in-depth, comprehensive treatment of existing and emerging photomask technologies available.

The Handbook of Photomask Manufacturing Technology features contributions from 40 internationally prominent authors from industry, academia, government, national labs, and consortia. These authors discuss conventional masks and their supporting technologies, as well as next-generation, non-optical technologies such as extreme ultraviolet, electron projection, ion projection, and x-ray lithography. The book begins with an overview of the history of photomask development. It then demonstrates the steps involved in designing, producing, testing, inspecting, and repairing photomasks, following the sequences observed in actual production. The text also includes sections on materials used as well as modeling and simulation.

Continued refinements in the photomask-making process have ushered in the sub-wavelength era in nanolithography. This invaluable handbook synthesizes these refinements and provides the tools and possibilities necessary to reach the next generation of microfabrication technologies. ——Features——————— · Provides a multi-dimensional view of photomask technology · Offers a general overview and detailed, in-depth discussions of photomask technology · Builds expertise on design and processing to optimize photomask constraints without sacrificing functionality and specs of the chip · Discusses mask writing, providing detailed treatment of electron beam writers and laser writers · Contains a complete walkthrough of the development process from conception to final testing, including modeling and simulation

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